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Top » Catalog » Z77 OC Formula
ASRock OC Formula Intel Z77 Chipset ATX Motherboard
[Z77 OC Formula]
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ASRock OC Formula Intel Z77 Chipset ATX Motherboard

12 + 4 Power Phase Design

ASRock Z77 OC Formula is designed with a 12 + 4 Power Phase design. It features sturdy components and completely smooth power delivery to the CPU. Plus, it offers unmatched overclocking capability and enhanced performance with the lowest temperature for advanced gamers as well.

Premium Alloy Choke (PAC)

Compared to iron powder choke, the new Premium Alloy Choke technology on ASRock OC Formula Motherboard Series highlights a special alloy formula which is able to reduce up to 70% core loss. The revolutionary choke construction features a highly-magnetic and heat-resistant design, increasing the board’s lifespan as well.

Dual-Stack MOSFET (DSM)

DSM is an innovative new design of MOSFETs. The silicon die area is increased by stacking two dies into a MOSFET. The larger the die area, the lower Rds(on). Compared to traditional discrete MOSFET, DSM can provide larger die area and lower Rds(on), so the power supply for CPU Vcore is more efficient.

Digi Power

Z77 OC Formula is equipped with CHIL 8328 silicon which features a new digital PWM (Pulse-Width Modulation) design, providing CPU Vcore voltage more efficiently and smoothly.

Twin-Power Cooling

Twin-Power Cooling combines active air cooling with water cooling. The ultimate heatpipe cooling design maximizes the system’s convection to expel hot air out, providing great air flow and faster heat dissipation.

Features:

*OC Formula Power Kit
*Digi Power
*Dual-Stack MOSFET (DSM)
*Multiple Filter Cap (MFC) (Filter different noise by 3 different capacitors: DIP solid cap, POSCAP and MLCC)
*Premium Alloy Choke (Reduce 70% core loss compare to iron powder choke)
*12 + 4 Power Phase Design
*OC Formula Connector Kit
*Hi-Density Power Connector
*15μGold Finger (CPU and memory sockets)
*OC Formula Cooling Kit
*Twin-Power Cooling (Combine active air cooling and water cooling)
*8 Layer PCB
*4 x 2oz copper
*GELID GC-Extreme Thermal Compound
*Supports NickShih's OC Profile, Formula Drive, FAN-Tastic Tuning, Multi Thermal Sensor
*Supports Fine-Tuning V-Controller, Interactive UEFI, Timing Configurator
*Supports Rapid OC, PCIe ON/OFF, V-Probe
*Supports ASRock XFast 555, Lucid MVP, Dehumidifier, OMG
*Free Bundle : 1 x Front USB 3.0 Panel, 10 x OC Stands



R2892.18 including VAT
For more information, please visit this products webpage.
This product was added to our catalogue on Thursday, 16. August 2012.
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